Apple has signed a new multi-year agreement worth over $30 billion with Broadcom to manufacture custom silicon chips in the US through 2031. The deal, supporting production of over 15 billion chips, includes Broadcom's $1.5 billion expansion in Colorado and forms the largest part of Apple's $600 billion US investment plan to strengthen domestic semiconductor manufacturing and AI chip development.
New Delhi: Apple has significantly expanded its partnership with Broadcom through a new multi-year agreement worth more than $30 billion, marking the company's largest manufacturing commitment in the United States and reinforcing its broader strategy to strengthen domestic semiconductor production.
The agreement, which extends through 2031, is expected to support the production of more than 15 billion chips in the US.
As part of the deal, Broadcom will invest $1.5 billion to expand its manufacturing facility in Fort Collins, Colorado, although neither company disclosed when the additional production capacity would become operational.
The expanded partnership builds on Broadcom's long-standing role as a supplier of wireless connectivity components for Apple.
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